Study High Speed Electronics

The high data rates and miniature scale of high-speed electronics require high signal and power integrity (SI/PI), with a low risk of interference or noise. As data rates increase, the signal frequency increases and signals propagate more like a high-frequency electromagnetic wave than a classical circuit current. Understanding the behavior of high-speed electronics goes beyond circuit simulation: it requires a full-wave 3D approach that can model these electromagnetic fields fully to help analyze the design of high-performance printed circuit boards.

Simulation in the EDA workflow

The “Virtual Twin” approach can replicate physical tests in the simulation environment. A Virtual Twin is a high-fidelity model of the system that includes all relevant data in one package. Common SI/PI tests such as IR dropeye diagram and bathtub plots can be replicated virtually, as can electromagnetic compatibility (EMC) test set-ups such as emissions measurement and bulk current injection (BCI).

Trustworthy Virtual Twins require accurate models. SIMULIA offers access to material databases with the properties of real proprietary substrates, and the ability to create custom materials from measured data using various material property models, such as frequency-dependent materials.

The electromagnetic simulation tools in CST Studio Suite can be integrated into EDA workflows using many industry-standard ECAD and MCAD tools, offering electronic engineers the ability to analyze SI/PI and EMC concerns at all phases of design: pre-layout, during layout and post-layout. Specialized tools provide engineers with rule-checkers and solvers needed to analyze integrated circuits (ICs), a printed circuit board (PCBs) and cables. General-purpose 3D solvers can simulate the entire board and the device as a whole.­­ The Broadband Macromodeling technology provided by IdEM enables SPICE model extraction from 3D electromagnetic field simulation. Conjugate heat transfer (CHT) simulation can be coupled to the electromagnetic simulation to analyze the thermal performance of electronics and to design cooling systems.

Electromagnetic Simulation in EDA

Signal Integrity Analysis

Signal Integrity (SI) is about maintaining the quality of data transmitted through a channel, allowing the digital pattern of ones and zeros to be reliably recovered from the analog signal. The main measure of this is the eye diagram – the shape formed on an oscilloscope by many random bits. Critical effects include jitter, loss and noise from sources such as crosstalk (interference between channels) and inter-symbol interference (interference between successive bits).

Statistical eye diagrams > Dassault Systèmes

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Explore the technological advancements, innovative methodologies, and evolving industry demands that are reshaping the world of Signal and Power Integrity Simulation. Stay a step ahead with SIMULIA. Discover now.

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