SIMULIA High-Tech Solutions

Batteries are among the largest components in any device, and maximizing their capacity is crucial to increasing battery life and reducing size and weight. Simulation helps battery engineers to design robust, safe battery cells and to understand and control heat within the device. Potential dangerous scenarios such as short-circuit, impact and swelling can be safely tested on a virtual twin. Links to BIOVIA Materials Studio also allow electrode and electrolyte chemistry to be analyzed.

Both the public internet and private networks require a strong backbone. With so many wireless devices all operating in complex environments and competing for spectrum, ensuring reliable and high-speed data connections without interference can be a challenge. Simulation can be used to design infrastructure backend devices from routers to transmitter antennas, and to optimize their performance as part of a full system. EMC performance, signal and power integrity and thermal cooling can all be analyzed as part of an integrated workflow.
Simulation is enabling the 5G rollout and the development of upcoming 6G technology, giving device designs and systems engineers the ability to analyze system performance before constructing a physical prototype. Network coverage in complex physical environments such as city streets or smart factories can be mapped using simulation to identify zones of poor reception under different scenarios and to optimize wireless antenna placement.

Consumer electronics represent one of the most important segments for the high tech industry. This is a highly competitive market, and customers are demanding devices that are not only faster and more efficient, but also smaller, lighter, cheaper and more stylish. Maintaining a competitive edge in this industry requires rapid development cycles in order to bring a product to market, while also minimizing risk of compliance test failures that lead to delays, costly redesigns and potentially even recalls.
Simulation is used by leading manufacturers of consumer electronics devices, from smartphones and laptops to wearables and smart products, in order to replace time-consuming and expensive physical prototypes with virtual testing. Performance, EMC, cooling and durability can be analyzed on a virtual twin of the real device, revealing potential issues much earlier in the design process and allowing them to be resolved quickly. Products can be brought to market faster and cheaper, with increased confidence that they will meet the requirements of users in the real world.

Integrated circuit (IC) chips are placed inside packages to protect them and allow them to be mounted onto printed circuit boards (PCBs). The package needs to be able to transmit signals from the data channels on the PCB, through contacts such as pins or ball-grid arrays (BGAs), and to the IC and back - all without causing interference or data loss.
Electronic engineers use simulation in the semiconductor packaging design process in order to model the propagation of currents through the socket and package and identify potential signal integrity (SI) and power integrity (PI) problems. Simulation can replicate standard electronic engineering tests such as time-domain reflectometry (TDR) and eye diagrams virtually, allowing engineers to find problems without having to construct a virtual prototype. Coupled electromagnetic-thermal simulation can also model cooling on the package, helping to optimize the placement of heat sinks and fans.