Design high-performance Printed Circuit Boards for EMC compliance
Connected electronic equipment is at the heart of our modern technological society. Dozens of electronic devices are already found in every household and every office, and these number will only increase as the promises offered by the Internet of Things (IoT) and the new 5G telecommunications standard come to fruition. The complexity of those devices is increasing as well: they have more functionality, contain more systems and support more communications standards, while being faster and more compact. In order to perform their intended functions reliably and safely in all conditions, these products need to have uncompromised signal integrity and power integrity at the chip, Printed Circuit Board (PCB) and device level, meeting design requirements with regard to signal integrity, power integrity, timing budget, crosstalk, eye diagram aperture, jitter, noise, voltage-drop and target impedance. At the same time they must be compliant with legal Electromagnetic Compatibility (EMC) and Electromagnetic Interference (EMI) limits.
The short design cycles in the High-Tech industry mean that there is no time for redesign: potential problem areas must be identified and resolved early in the design cycle. The Electronics Design Analysis solution by Dassault Systèmes SIMULIA achieves this by allowing the use of multi-scale simulation, from circuit to full 3D level, throughout the design process, with CST Studio Suite. Full-wave 3D simulation is especially important for understanding high performance, high-speed devices which are compact and densely packed with electronics. PCB performance analysis may be studied at pre- and post-layout stages, using dedicated PCB import functionality and a range of dedicated high performance solvers to ensure that all effects are considered.
Compliance to international EMC Standards is mandatory for products to go to market. National and international organizations (e.g. IEC, CISPR, FCC) work to promote international co-operation on standardization and harmonization. The Electronics Design Analysis solution by Dassault Systèmes SIMULIA seamlessly combines circuit and 3D electromagnetic simulation within CST Studio Suite, including models of switching circuits at circuit level and parasitic effects at full 3D level, thus predicting the real-world performance of complex systems. Using this approach, electromagnetic interference, cross-talk, conducted and radiated emissions and susceptibility can be fully understood and controlled before they become a problem.
Modern multi-function printers include many electronic components - often modular to ensure commonality - and these can interfere with each other causing electromagnetic compatibility (EMC) issues. In addition, electrostatic discharge (ESD) can affect the performance of individual components. Where EMC issues arise during testing, it is not always clear what the cause is.
Dassault Systèmes Response
In order to better understand the mechanisms behind these and to find effective mitigation techniques, Fuji Xerox decided to use electromagnetic simulation with CST Studio Suite. The variation in scale between the UI PCB and the frame of the printer meant that simulating them both together was a challenging task. Thanks to the high-performance computing (HPC) capabilities of CST Studio Suite, the entire model could be simulated within a workday.