Discover how Hyliko uses the 3DEXPERIENCE platform to design, simulate and scale hydrogen trucks for zero-emission long-haul freight.
Customer Story
Transform semiconductor innovation and engineering using design data governance as a competitive advantage
Semiconductor IP Management provides a unified approach to handling design data, intellectual property assets, requirements, changes and collaboration across the entire silicon lifecycle. Effective management scales IP reuse and maintains full traceability for complex System-on-a-Chip (SoC) development.
Without a governed environment, organizations struggle to keep pace with skyrocketing design complexity. This connected approach ensures that all stakeholders work from a shared, trusted source of information. It minimizes the risks of production delays, data silos and late-stage rework that can derail semiconductor delivery.
Semiconductor leaders are no longer competing on transistor density alone, but on how intelligently they manage, reuse and protect design data. As advanced nodes, chiplets, AI accelerators and automotive systems increase complexity, reusable IP and cross-domain dependencies continue to grow.
Traditional methods of managing design data and engineering processes can no longer keep pace. Semiconductor IP Management from Dassault Systèmes provides secure IP governance, structured change management, lifecycle traceability and cross-discipline collaboration across globally distributed teams and partners.
The 3DEXPERIENCE platform advances semiconductor IP management by providing a unified, governed environment where teams collaborate on product definitions in real time. It goes beyond a simple point solution by unifying design data, project execution and IP reuse on a single enterprise-ready foundation.
3D UNIVERSES build on the 3DEXPERIENCE platform foundations, connecting value networks with virtual twins and industrial AI. These virtual twin experiences enable teams to flexibly model, simulate and analyze semiconductor products and processes with the click of a button. This ensures that every aspect of the IP lifecycle is optimized for performance, quality and regulatory adherence, fostering innovation while mitigating risks.
Unify design data, IP reuse, requirements and change management in a governed Semiconductor environment. Enable digital continuity across complex SoC and chiplet programs with full traceability, controlled maturity states, scalable IP reuse, reduced rework and confident tape-out decisions.
Enable secure global engineering collaboration with automated provisioning, standardized design environments, and role-based access control. Reduce manual setup, configuration drift, IT overhead and IP leakage risks across multi-partner development programs.
Keep engineers productive in native EDA environments with integrated revision control, Semiconductor item and IP management. Support Cadence, Synopsys, Git, GitHub, GitLab, Artifactory and DesignSync for repository-agnostic collaboration across diverse semiconductor workflows.
Embedding sustainability into each stage of the semiconductor lifecycle—from initial concept to end-of-life—is essential for minimizing environmental impact and enhancing long-term business resilience. By integrating sustainability criteria directly into data-driven lifecycle workflows, engineering teams can make more informed decisions regarding materials selection, energy consumption and supply chain logistics.
Managing complex multi-level SoC programs requires a modern, web-based experience for reviewing, validating and sharing design information. The 3DEXPERIENCE platform empowers Integrated Device Manufacturers (IDMs), fabless semiconductor companies and OEMs to design custom silicon with unprecedented clarity.
By maximizing data reuse and simplifying product structures early in the development phase, organizations reduce the time required to define the engineering baseline. Clear responsibilities and automated tool provisioning ensure compliance with organizational standards from the earliest stages of development.
How Companies are Using ENOVIA Semiconductor IP Management
A key benefit is seeing how design changes affect the entire project. Engineers can trace how a modification in one area, such as an updated material property or new load condition, influences related simulations downstream. This gives them the confidence to decide whether further analysis is needed or if existing results remain valid.
Using the 3DEXPERIENCE platform to implement our SPDM solution was a no-brainer. We needed a single source of data that is accessible and shareable, where we can easily find and reuse the information we need.
Discover how Hyliko uses the 3DEXPERIENCE platform to design, simulate and scale hydrogen trucks for zero-emission long-haul freight.
Customer Story
EODev tackles the sustainable power generation challenge by industrializing hydrogen systems with the 3DEXPERIENCE platform.
Customer Story
Discover how FLYING WHALES uses the 3DEXPERIENCE platform to design and build their helium-electric hybrid airship for heavy cargo logistics.
Customer Story
Virya Autonomous Technologies adopted the 3DEXPERIENCE platform on the cloud to support the design and development of its robots from beginning to end.
Customer Story
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