Numerical simulations have found growing interests in evaluating interconnect reliability in electronic packaging, particularly for lead-free solder joints. To achieve good predictive capability, appropriate constitutive properties for the solder balls and a damage mechanism based life prediction model must be provided. In this paper, a simple published but efficient approach is adopted to predict life of SnAgCu joints subjected to temperature cycling. The complete finite element model and its analysis are done in ABAQUS using its scripting interface. Finally a numerical example is presented to illustrate the procedures, and, hence, demonstrates the capability of ABAQUS in electronic packaging modeling.
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