Generative Product Development

Structured PLM Collaboration digitally connects cross-functional and geographically dispersed teams around a single, trusted source of product data. On the 3DEXPERIENCE platform, product documents and engineering content are securely organized, attached to product structures and accessible in context throughout the lifecycle. Real-time dashboards, intuitive navigation, document comparison, and 3D KPI visualization enhance decisions while ensuring IP security with controlled access and collaboration.

Multidiscipline Configured Product Development unifies mechanical, electrical and software definitions into a single configured product structure, enabling holistic engineering management from concept to release. Teams collaborate on a shared product architecture, manage all variants and effectivities in one structure and maximize reuse while reducing complexity and governance overhead. 

3D Product Validation enables collaborative review of real-time digital mockups to detect, track and resolve interferences before physical prototypes are built. Issues, actions and 3D data remain connected for full traceability, allowing enterprise-wide participation without requiring local CAD downloads. Automated and interactive validation processes, lightweight visualization for large assemblies and secure external representations protect IP while accelerating design maturity and reducing costly rework.

Formulated Product Development manages specifications, raw materials, packaging artwork and labels as structured, connected data rather than disconnected documents. By maintaining digital continuity from formulation through packaging and regulatory reporting, companies accelerate multi-market launches, ensure brand consistency and simplify compliance. Artwork and labeling are managed within the product hierarchy and connected to the virtual twin, enabling faster updates, traceability and parallel execution of supply chain and compliance processes. 

Semiconductor Development manages complex design hierarchies through a modular approach optimized for reuse, global collaboration and performance. On the 3DEXPERIENCE platform, semiconductor data, embedded software and multi-EDA tool outputs are governed by a single source of truth, enabling cross-site collaboration through integrated revision control. Modular design hierarchy management maximizes reuse of existing designs and embedded software while reducing costs and time-to-market.