CAVE3 Electronics Research Center is a National Science Foundation Industry-University Cooperative Research Center at Auburn University. The Center focuses on research related to electronics design, reliability, and prognostics in harsh environment applications such as automobiles, military, defense, and aerospace.
To study drop reliability and cracking in solder interconnects under impact loading to develop more durable electronic products.
Realistic simulation with the eXtended Finite Element Method (XFEM) software from Dassault Systèmes SIMULIA brand was chosen for Auburn University’s study to evaluate drop reliability and cracking in all the corner solder interconnects, the most vulnerable joints to crack during a drop.
By using simulation, engineers can make their products more durable and able to withstand greater impacts while minimizing time and cost compared to real-world drop testing.