推动半导体创新:从原子到设备

现代世界需要速度更快、功能更强的电子设备,因此它们所依赖的组件也必须以前所未有的快速度发展。半导体的尺寸越来越小、功耗越来越少、带宽越来越高。但是,随着微芯片的物理尺寸越来越接近基本限制,制造难度也与日俱增。

建模与仿真是在设备设计的过程中,使用电子结构仿真来支持这些电子组件的开发,从纳米级半导体到柔性有机薄膜晶体管再到生物传感器,不一而足。 同样重要的是,通过对材料的结构、电子、热和机械属性进行建模,提高集成电路的可靠性。

完整的建模与仿真工具集

BIOVIA Materials Studio 提供完整的建模与仿真工具集,用于探索支撑半导体、晶体管和光伏功能的关键材料属性。

 

半导体制造

  • 阐明定义电子属性的设备特征
  • 确定缺陷对性能的影响
  • 氧化物-氧化物界面评估
  • ALD、CVD 前驱体评估和设计
  • 测定态密度和能带间隙(带偏移)
  • 光刻胶分析和气体扩散分析
  • 电子传递以生成 IV 曲线,从而帮助设备设计
  • 传感功能的光学属性
  • 预测显示技术中使用的晶体管材料的发射光谱
  • 设计薄膜晶体管,以符合溅射对晶体形态的影响

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