Vélizy-Villacoublay, France, May 27, 2009 - Dassault Systèmes (DS) (NASDAQ: DASTY, Euronext Paris: #13065. DSY. PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, today announced that 3DVIA Shape and 3DVIA.com are serving as the 3D modeling tools for the Mobi3 program during its second year. Mobi3 launched the second edition of its year-long program in 2008 by continuing the partnership between five multi-national companies, Dassault Systemes, DLA Piper, IBM, Nokia and SFR; two nonprofits IMS - Entreprendre pour la Cité and the European Engage Network; and the French Ministry of Education. This year’s goal is to help 120 middle school students from economically disadvantaged neighborhoods in Paris. Through the program, the students will participate in a hands-on team project to discover the product design and development process of a mobile phone.
The Mobi3 program highlights the complementary role that each partner company plays in the mobile phone’s lifecycle, from design to sales and recycling. DS provides insight into 3D design, Product Lifecycle Management (PLM) and how industrial processes are simulated. Students will also get a feel for what it is like to work as a 3D design engineer.
“Dassault Systèmes being a world leader in PLM, provides a crucial perspective to this project. Its 3DVIA brand offers our students easy-to-use, collaborative tools that allow them to jump right into the product development process,” explained Stéphane Guérault, teacher at the Ariane middle school in the Paris region. “We’ve already seen how the 3D tools are empowering the students and anticipate a very exciting finish to this year-long competition.”
Student teams have started to create mobile phone designs and digital prototypes using DS’ 3DVIA Shape and 3DVIA.com. 3DVIA Shape, professional grade 3D publishing software in a consumer friendly package, provides a free and easy way for the students to create their ideas in 3D and share them online. 3DVIA.com, a community and resource for 3D artists and enthusiasts, provides a place for the students to search, upload and share ideas. The students, as well as the teachers, are able to create and share 3D models of mobile phones and of their schools on a Mobi3 3DVIA.com group specially created for the project. Along with the designing process, students are also able to make proposals on how they would manage each phase of the phone’s lifecycle.
At the end of the year-long program in May, the finalist team from each school will present their project to a jury of professionals from participating companies, who will then select the winning team. The winning team will visit the Nokia Design Lab in London.
“By providing students with an introduction to the world of 3D content creation and experience, we are able to prepare them for their future, regardless of their career path, as 3D continues to grow in importance for both businesses and consumers,” said Lynne Wilson, senior vice president and general manager, 3DVIA, Dassault Systèmes. “We look forward to working closely with the students as they learn about and experience the power of 3D.”
Mobi3 is coordinated by the Europe-wide ENGAGE program formed by the Business in the Community (BITC) in London. This program is aimed at bringing together businesses and community organizations around the globe to increase the quality and amount of employee community engagement within their local communities. The success with Mobi3 in France was such, that the plan is to expand the program to Italy during the 2009-2010 school year. 3DVIA Shape and 3dvia.com will, then again, participate in the program as the 3D design tool for students and teachers.
To see the students working examples on their 3D projects, go to blog.crdp-versailles.fr/mobi3ariane/index.php/page/10
For more information on 3DVIA, go to www.3dvia.com. For more information on Mobi3, go to www.engageyouremployees.org/uploads/documents/mobi3_summary_report.pdf.