Intellisense Software Corporation

IntelliSense ignited the MEMS industry in the early 1990s with its IntelliSuite® family of innovative CAD and EDA tools and is now a leading innovator and supplier of design and development solutions for MEMS professionals. With users in more than 35 countries, IntelliSense offers software tools to universities, blue-chip companies and start-ups worldwide. Whether analyzing a device using one of the Fastfield Multiphysics tools or simulating a complex process flow with the CleanRoom collection of simulators, the possibilities are endless with IntelliSuite. 

In addition to IntelliSense's world class design software package, IntelliSense offers custom design, consulting, and fabrication services as part of their One Stop MEMS Solution. For more information about IntelliSense, visit IntelliSense or www.intellisenseblog.com  

One of the key tools in the IntelliSuite lineup is the ThermoElectroMechanical Analysis Module. With this fully coupled Fastfield Multiphysics tool, users can perform thermal, electrostatic, fluidic, and mechanical, and piezo simulation of their MEMS devices with ease. Some key features include the abilities to perform dynamic contact analysis and coupled package-device simulation. The TEM Analysis Module uses Hexpresso, IntelliSense's robust and efficient meshing engine, along with the Abaqus solving engine to perform simulations efficiently and with great accuracy. Additionally in TEM, advanced model order reduction based extraction techniques capture the electromechanical, fluidic, and damping behavior into compact models. With the included EDA Linker, users can seamlessly work with these models in other leading EDA environments. Visit the TEM Analysis Mode  page for more technical information and simulation examples.

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