Computational Dynamics Limited

CD-adapco employs over 800 talented individuals, working at 30 offices around the globe, involved in dedicated support, software development and engineering services
 
CD-adapco is the world's largest independent CAE-focused provider of engineering simulation software, support and services. We have over 30 years of experience in delivering industrial strength engineering simulation. The scope of our activities extends well beyond software development to encompass a wide range of CAE engineering services in both CFD and FEA.We have over 8000 users of our software, working at 3000 different companies, spending over $175 million on our software and services CD-adapco’s purpose is “Engineering Success”. We help our customers to succeed through the application of engineering simulation: driving innovation in products; reducing the engineering time and cost of bringing those products to market.

CD-adapco's industry leading simulation tool, STAR-CCM+, has a direct connection to Abaqus, delivering fully coupled, implicit two-way, fluid-structure interaction (FSI). Using direct co-simulation coupling provides efficiency and reduced overhead usually associated with data transfer through file exchanges or use of external middleware software. This co-simulation capability makes fluid-structure-thermal calculations a regular part of the engineering design process.

The close technological CD-adapco and SIMULIA partnership also means that setting up and running the problem may all be done within the easy-to-use STAR-CCM+ environment, with no need for additional scripts and input files or mapping data. The powerful physics of both codes may be leveraged in coupled FSI with STAR-CCM+’s full range of available models, providing the ability to study coupled, single and multiphase flows, chemical reaction and combustion as well as flow regimes from low speed to hypersonic. The options available in Abaqus are similarly broad, with coupled simulation supported for static stress/displacement, dynamics (implicit and explicit), heat transfer, temperature-displacement, thermal-electrical and piezoelectric analysis.