Modern electronic devices are a marvel of technology, capable of performing numerous functions in all manner of environments. They are packed to the brim with components with every square millimeter used. This trend toward miniaturization and high-density packaging brings new engineering challenges. All these components don’t just have to function in isolation, they have to work in close proximity with one another, and so the potential for interference is great.
In order to perform their intended functions reliably and safely in all conditions, these products need to have uncompromised signal integrity and power integrity at the chip, Printed Circuit Board (PCB) and device level, meeting design requirements for signal integrity, power integrity, timing budget, crosstalk, eye diagram aperture, jitter, noise, voltage-drop and target impedance. At the same time, they must comply with legal Electromagnetic Compatibility (EMC) and Electromagnetic Interference (EMI) limits.
Short design cycles in the High-Tech industry mean there is no time for redesign: potential problem areas must be identified and resolved early in the design cycle. The Electronics Design Analysis solution offers multi-scale simulation, from circuit to full 3D level, throughout the design process, with CST Studio Suite. Full-wave 3D simulation is especially important for understanding high performance, high-speed devices which are compact and densely packed with electronics. PCB performance analysis may be studied at pre- and post-layout stages, using dedicated PCB import functionality and a range of dedicated high performance solvers to ensure that all effects are considered.
Simulation can help accelerate device validation and certification, ensuring that all the components function at peak performance both individually and in concert with the many other components within the device.
Electromagnetic Compatibility (EMC)
Compliance to international EMC Standards is mandatory for products to go to market. National and international organizations (e.g. IEC, CISPR, FCC) work to promote international co-operation on standardization and harmonization. The Electronics Design Analysis solution by Dassault Systèmes SIMULIA seamlessly combines circuit and 3D electromagnetic simulation within CST Studio Suite, including models of switching circuits at circuit level and parasitic effects at full 3D level, thus predicting the real-world performance of complex systems. Using this approach, electromagnetic interference, cross-talk, conducted and radiated emissions and susceptibility can be fully understood and controlled before they become a problem.
Electronics Design Analysis Workflows
Signal integrity analysis helps to ensure that all components within a device can communicate reliably at high data rates. Using simulation to analyze the signal integrity performance of electronic devices has many benefits:
- Reduce susceptibility to noise and interference and increase data rates
- Simulation gives insight into complex internal interaction through visualization
- Promote reliable communication
Power integrity is crucial to ensuring the correct power and voltage levels are available wherever needed. There are many benefits to performing power integrity analysis and simulation.
- Minimize power losses, increase battery life and component reliability
- Ensure consistent power distribution at system level
- Minimize power distribution network noise
Electronics EMC compliance
Electromagnetic compliance is crucial when designing a device to avoid unwanted interference between highly sensitive internal electronics and the broader environment. Compliance with international EMC Standards is mandatory for products to go to market. Benefits of using simulation for EMC analysis include:
- Reliable performance under real-life conditions
- Susceptibility analysis
- Reduced reliance on physical test
- Evaluate device level emissions
Modern smart devices house many sensors and actuators that interact with the real world. The sensors performance workflow examines the complexities involved:
- Simulate a wide range of physical phenomena
- Evaluate performance under countless scenarios
- Multi-physics analysis on the 3DEXPERIENCE platform
Wireless Charging Design
Wireless charging is an inherently multi-physical problem. In particular, thermal considerations need to be taken into account. Benefits of the Wireless Charging Design workflow include:
- Multi-physics analysis – coupled electromagnetic, thermal and structures simulation
- Easy design space exploration
- Charging efficiency analysis