Ever-shrinking form factors, more complex product integration (e.g System-on-a-Chip, System-in-Package) and growing environmental compliance demands make semiconductor package performance and reliability improvement ever more challenging. Virtual testing using realistic simulation software offers packaging engineers the ability to assure requirement compliance while minimizing total product cost and time to market. Virtual testing is orders of magnitude faster than physical testing, and reduces costly overhead and time-consuming test setup.
The Semiconductor Packaging Simulation solution reduces the need for fabricating test prototypes by substituting virtual testing and lifecycle prediction. This industry solution experience is based on the SIMULIA Unified Abaqus FEA application suite and provides advanced material models for electronics applications. Modern progressive fracture/failure capabilities, best-in-class solver performance and interactive programming capabilities enable efficient model generation and preparation. Supported simulation methods enable robust coupled-field analysis of thermal, electrical, mechanical (both static and dynamic) and moisture-sensitivity load regimes. Multiple load types can be applied to a single model and techniques are available to efficiently handle different size scales typically found in electronic assemblies. Engineers are able to predict complex real-world behavior with best-in-class steady-state and transient analyses. Errors are detected early in the design process resulting in huge savings in time and costs. The solution provides detailed insight into the product behavior under a variety of manufacturing, shipping and operating conditions such as manufacturing/assembly loads, shipping and handling conditions, operating conditions and material characterization.