Designing Interconnects

On Demand

Meet the challenge of designing connectors and interconnects as digital speeds increase and the design requirements become broader in scope.

As digital speeds increase, connectors and interconnects have become more challenging to design. In addition to this, the design requirements themselves are becoming broader in scope. In this eSeminar we will show how a large number of electromagnetic solvers that we refer to as complete technology for 3D electromagnetic simulation can leverage a diverse and powerful set of solvers and feature workflows to meet these challenges.

With this eSeminar, learn how to:

  • Select the best solver for a particular interconncect application

About the presenter

Tracey Vincent is a Senior Application Engineer at SIMULIA a Dassault Systèmes brand. She has a combined Bachelors/Masters Degree in Electrical and Electronic Engineering from Herriot-Watt University in Edinburgh, Scotland and a Masters degree from Napier University, Scotland, where she wrote an FEA program to solve fields in ferrimagnetic materials. Vincent has ten years experience as a design engineer. She completed her Ph.D. at WPI in Worcester, MA, in 2009, where she investigated the effect of material topography on RF signal loss.