Agenda

Time

Title

8:30

Introduction and Opening Video

8:45

SIMULIA Update

9:30

Simulation for Product Development at HP Inc
Dan Fradl and William Humphrey, Hewlett-Packard

10:00

Break

10:30

SIMULIA High Tech Industry update

11:15

Accelerating Innovation with the 3DEXPERIENCE Platform

12:00

Lunch

1:30

Technology Update: Additive Manufacturing

2:00

Electromagnetics – Expanding the SIMULIA Simulation Universe

2:45

Contact Pin Compression Analyses Using Abaqus for Qualcomm Centriq™ Server Chip
Ben Nagaraj, Qualcomm

3:15

Break

3:45

Electromagnetic – Eddy current analysis
Piotr Zajac, Solar City

4:15

New Applications and New Technology in the Power of the Portfolio

5:00

Closing Remarks

5:15

Reception in Welcome Center