High Tech Industry Solutions

Semiconductor companies that can deliver a steady stream of winning designs stand to gain substantial long-term competitive advantage. While many companies are able to create breakthrough products, they struggle to do so in a consistent and timely manner, sacrificing speed and quality in one project to accommodate success in another. With rapidly changing customer requirements and ever-shrinking product shelf lives, winning companies will be those that produce innovative designs and can easily manage multiple complex chip development projects across a distributed design chain of internal employees, IP vendors, and design partners.

There are many different load regimes that must be considered in the mechanical qualification of a new semiconductor design, including thermal performance, vulnerability to shock, and moisture sensitivity. Production of prototype parts followed by physical testing is a time consuming process. And the need is recognized by Semiconductor companies to integrate change management and the flow of information from test through manufacturing and design teams to ensure that the products always match the design intent and manufacturing goals. 

Dassault Systemes (DS) has responded to the specific needs of semiconductor companies by providing end-to-end Semiconductor Engineering solutions that covers IC (Integrated Circuit) design, analysis, and extended enterprise project management across the IC design chain. Various design flow templates that include elements such as IC-Digital Flow, IC-Microprocessor Flow, IC-Memory FLOW, IC- CMOS Manufacturing process etc. are provided to improve the productivity of the entire development process, from concept to silicon.

DS’s unified modeling and simulation environment enables semiconductor companies to do virtual product qualification that provide major time savings, leading to reduced time-to-market and improved productivity. Our solution includes advanced material models for leaded and lead-free solder, modern progressive fracture/failure capabilities for thermo-mechanical delamination, best-in-class solver performance and interactive capabilities to make model generation and preparation more efficient.

Our solution takes into account the workflows and processes of chip design teams as well as the challenges that they face on day-to-day basis. Through project dashboards, we provide management with real-time visibility into project status in terms of process, costs and benefits, allowing decision makers to easily determine which projects have the highest probability for success.