Feb 18 2010

ExxonMobil and Tetra Pak Highlight 2010 SIMULIA Customer Conference

International Community Gathers to Discuss Advances in Realistic Simulation Technology and Methods

Paris, France and Providence, R.I., USA, February 18, 2010 – Dassault Systèmes (DS) (Euronext Paris: #13065, DSY.PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, today announced that keynote addresses from ExxonMobil Upstream Research Company and Tetra Pak will highlight the SIMULIA Customer Conference (SCC) being held May 25-27, 2010, in Providence, Rhode Island, U.S.A.

Keynote speakers, Bruce A. Dale, senior consultant, ExxonMobil Upstream Research Company and Mattias Olsson, Ph.D, manager, Virtual Engineering, Tetra Pak, will provide insights into how realistic simulation is being used by their respective companies to drive research and product innovation. Mr. Dale’s presentation will highlight technical achievements from ExxonMobil’s three-decade history of using SIMULIA’s Abaqus FEA to enable engineering advancements in the upstream oil & gas industry. Dr. Olsson will share Tetra Pak’s experience in using realistic simulation solutions from Dassault Systèmes’ SIMULIA brand to develop innovative product packaging for delivering liquid food products to global consumers at a low price while extending shelf-life and ensuring safety.

"Our customers are passionate about sharing their experiences in using realistic simulation to achieve business benefits and deliver innovative products that improve society and our daily life," stated Ken Short, VP, Strategy and Marketing, SIMULIA, Dassault Systèmes. "Those attending our international conference will gain unique insights from Mattias and Bruce on how their respective companies are improving the world we live in by creating innovative solutions for affordable, safe food packaging and cleaner, more efficient energy production."

The 2010 SCC will showcase presentations by engineers representing more than 70 international manufacturing and research organizations, including Cordis Corporation, Halliburton, Honda R&D, Kimberly-Clark, Medtronic, Michelin R&D, NOKIA, PSA Peugeot, Rolls-Royce, Verney Yachts, and many others. Sessions will include topics on fracture and failure, nonlinear analysis, multiphysics, process automation, design optimization, Simulation Lifecycle Management, and more.

CD-adapco is the Premier Sponsor of the 2010 SCC and there will be more than 20 Exhibitor Sponsors including: ACUSIM Software, BETA CAE Systems, Bodie Technology, CAPVIDIA, Collier Research - HyperSizer, e-Xstream engineering SA, FE-Design GmbH, Firehole Technology, Fraunhofer Institute SCAI, Global Engineering & Materials, Granta Design, GRM Consulting Ltd., LMS International, Northwest Numerics & Modeling, Quest Integrity Group, Safe Technology, and Software Cradle.