One of the key tools in the IntelliSuite lineup is the ThermoElectroMechanical Analysis Module. With this fully coupled Fastfield Multiphysics tool, users can perform thermal, electrostatic, fluidic, and mechanical, and piezo simulation of their MEMS devices with ease. Some key features include the abilities to perform dynamic contact analysis and coupled package-device simulation. The TEM Analysis Module uses Hexpresso, IntelliSense's robust and efficient meshing engine, along with the Abaqus solving engine to perform simulations efficiently and with great accuracy. Additionally in TEM, advanced model order reduction based extraction techniques capture the electromechanical, fluidic, and damping behavior into compact models. With the included EDA Linker, users can seamlessly work with these models in other leading EDA environments. Visit the TEM Analysis Mode page for more technical information and simulation examples.