AMD is a global supplier of integrated circuits for personal and networked computing and communications, based in Sunnyvale, California.
도전 과제
Advanced Micro Devices (AMD) needed a way to predict and prevent crack formation and delamination in the flip-chip version of its integrated circuits
다쏘시스템의 응답
AMD chose Abaqus FEA from SIMULIA to study the effects various underfill design variables
이점
Thanks to complex studies conducted with Abaqus FEA, AMD came up with a list of improvements to the underfill layer, which optimized flip-chip reliability and durability