INSIDE Contactless Improves Global Collaboration and Design Cycle Efficiency with Dassault Systèmes
2009/05/18ENOVIA Synchronicity Solution Catalyst for Optimized Product Design and IP Reuse
LOWELL, Mass., USA – May 18, 2009 - Dassault Systèmes (DS) (Euronext Paris: #13065, DSY.PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, today announced that INSIDE Contactless, a global leader in open-standard contactless payment and Near Field Communication (NFC) semiconductors, has successfully implemented the ENOVIA Synchronicity DesignSync solution, which is part of the V6 family of products, to improve the efficiency of its product development and design process. INSIDE Contactless is using the DesignSync solution to design high-performance contactless chip technologies for next-generation payment, transit, identity and access control applications. INSIDE’s secure contactless and NFC solutions are currently found in smart cards, key fobs, mobile phones, handheld devices, point-of-service systems and PC peripherals.
“Designing semiconductor products for smart card and banking applications requires robust, collaborative software, flexibility within concurrent development projects, traceability and intellectual property protection,” said Michel Martin, IC Design Manager at INSIDE Contactless. “The deployment of a semiconductor industry-specific collaborative design data and configuration management solution from Dassault Systèmes has enabled us to store, share and manage data effectively and implement and scale best design practices in the company.”
By leveraging Dassault Systèmes ENOVIA Synchronicity DesignSync Data Manager, DesignSync DFII and ProjectSync INSIDE Contactless has been able to improve global team collaboration while also optimizing product design. This approach has enabled INSIDE Contactless to increase system-on-chip design integration efficiencies and IP reuse by utilizing modular data abstraction within a hierarchical design data and configuration management system.
“In an industry with ever-increasing product complexity, INSIDE Contactless is using the power of ENOVIA DesignSync to cut costs and bring contactless technology to its customers faster,” said Fabrice Mekersi, director, Europe, Middle East & Africa, High-Tech and Semiconductor, ENOVIA, Dassault Systèmes. “Dassault Systèmes’ solutions have helped INSIDE Contactless streamline multi-site circuit design, integrating data from often dispersed design teams. This kind of collaborative innovation is increasingly important for sustainable business.”
For more information on Dassault Systèmes’ ENOVIA solutions for the semiconductor industry, please visit the high-tech section of the company’s Web site.
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INSIDE Contactless
INSIDE Contactless is the global leader in open-standard contactless payment and Near Field Communication (NFC) semiconductors and software that power the next generation of payment, transit, identity and access control applications. The company’s intelligent, microprocessor-based platforms offer the flexibility to be embedded in smart cards, mobile phones and other consumer electronic devices, documents, badges and other items to support a wide range of innovative contactless applications and bring new levels of convenience to users. INSIDE has delivered more than 300 million contactless platforms worldwide to customers and partners that include many of the leading payment card and mobile phone manufacturers, systems integrators and financial institutions. With a portfolio of 60 families of patents, including several essential NFC patents, the company has played a leading role in NFC and contactless innovation. INSIDE is headquartered in Aix-en-Provence, France, with offices in Shanghai, Singapore, Warsaw, Seoul and Silicon Valley. For more information, please visit us at www.insidecontactless.com.
ダッソー・システムズについて
ダッソー・システムズは、3DとPLMソリューションにおけるワールド・リーダーとして、80カ国以上、100,000以上のお客様にそのバリューを提供しています。1981年から3Dソフトウエア市場におけるパイオニアであるダッソー・システムズは、業界プロセスを支援するPLMアプリケーション・ソフトウエアおよびサービスを開発・販売し、コンセプト設計からメンテナンス、リサイクルに至る全製品ライフサイクルにおける3Dビジョンを提供します。提供内容は、バーチャル製品設計のためのCATIA、3Dメカニカル設計のためのSolidWorks、バーチャル・プロダクションのためのDELMIA、バーチャル･テスティングのためのSIMULIA、グローバルなコラボレーティブ・ライフサイクル・マネジメントのENOVIA、オンライン3Dライフライク・エクスペリエンスの3DVIAが含まれます。ダッソー・システムズはNasdaq（DASTY）およびEuronext Paris（#13065, DSY, PA）証券取引所に上場しています。
URL: http://www.3ds.com （英語）、 http://www.3ds.com/jp (日本語)
CATIA、DELMIA、ENOVIA、SIMULIA、SolidWorksおよび3DVIAは、ダッソー・システムズ（Dassault Systèmes）もしくはダッソー・システムズの子会社の米国およびその他の国における登録商標です。
その他の製品名および会社名は、それぞれ各社の商標または登録商標です。