Dassault Systèmes to Showcase Next Generation PLM Solutions at ENOVIA Americas Customer Conference, May 6-9
2008/04/22Spotlight on V6 PLM Platform, Customer Success Stories, Strategic Partners and New Industry Vertical Solutions
LOWELL, Mass., April 22, 2008- Dassault Systèmes (DS) (Nasdaq: DASTY; Euronext Paris: #13065, DSY.PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, today released further details about its upcoming ENOVIA Americas Customer Conference (EACC) which will be held at the Orlando World Center Marriott in Orlando, Florida from May 6-9, 2008. Themed “Learn. Network. Share. Succeed,” the event will provide an excellent opportunity for hundreds of executives from a broad array of industries, to learn more about Dassault Systèmes’ V6 PLM platform and the newest ENOVIA solutions.
EACC will allow ENOVIA customers to understand the concept of “PLM 2.0” and experience Dassault Systèmes’ breakthrough V6 PLM platform through education, training, demonstrations and customer presentations. The V6 platform, unveiled in January and scheduled for general availability in May, delivers a single platform for all PLM business processes, available to anybody anywhere, spanning engineering groups, business and end users. V6 also gives intelligent access to all IP no matter the data source location, with ENOVIA MatrixOne technology built into the foundation.
“The EACC is an important element in creating an open, ongoing dialogue with our customers where we get the chance to really explore the common challenges and opportunities. It creates a great environment to share the latest technological developments and discuss the evolution of PLM,” said Mike Segal, senior vice president of global sales operations, ENOVIA, Dassault Systèmes.
EACC highlights include:
• In-depth presentations and break out sessions on PLM 2.0 and the V6 PLM platform.
• Customer keynotes from companies such as Under Armour, Parker Hannifin, Motorola, Gulfstream and GUESS;
• Industry keynotes by Bruce Richardson, AMR Research and Robert Tucker, author of “Driving Growth Through Innovation” and President, Innovation Resource
• An Alliance Partner Pavilion showcasing new solutions from Microsoft, IBM, TGS, Processia, Integware, Coastal Logic and many more;
• Industry-specific breakout tracks featuring customers such as GE in the industrial manufacturing track; Abbott in the life sciences track; and Texas Instruments in the high-tech track; in addition to sessions on PLM strategies and solutions for companies from the mid-market to complex global enterprises
• The ENOVIA Product Strategy Forum (PSF), a half day workshop held between ENOVIA customers and the ENOVIA research and development (R&D) team for a deeper dive into ENOVIA product vision and plans.
ENOVIA will be hosting similar customer conferences in Munich in June, and Tokyo in September. For more information or to register, go to http://www.3ds.com/enovia/eacc
ダッソー・システムズについて
ダッソー・システムズは、3DとPLMソリューションにおけるワールド・リーダーとして、80カ国以上、100,000以上のお客様にそのバリューを提供しています。1981年から3Dソフトウエア市場におけるパイオニアであるダッソー・システムズは、業界プロセスを支援するPLMアプリケーション・ソフトウエアおよびサービスを開発・販売し、コンセプト設計からメンテナンス、リサイクルに至る全製品ライフサイクルにおける3Dビジョンを提供します。提供内容は、バーチャル製品設計のためのCATIA、3Dメカニカル設計のためのSolidWorks、バーチャル・プロダクションのためのDELMIA、バーチャル･テスティングのためのSIMULIA、グローバルなコラボレーティブ・ライフサイクル・マネジメントのENOVIA（ENOVIA VPLM、ENOVIA MatrixOne、ENOVIA SmarTeam）、オンライン3Dライフ・エクスペリエンスの3DVIAが含まれます。ダッソー・システムズはNasdaq（DASTY）およびEuronext Paris（#13065, DSY, PA）証券取引所に上場しています。
URL: http://www.3ds.com （英語）、http://www.3ds.com/jp(日本語)
CATIA、DELMIA、ENOVIA、SIMULIA、SolidWorksおよび3DVIAは、ダッソー・システムズ（Dassault Systèmes）もしくはダッソー・システムズの子会社の米国およびその他の国における登録商標です。
その他の製品名および会社名は、それぞれ各社の商標または登録商標です。