Whitepaper: Creep Analysis of Lead-Free Solders Undergoing Thermal Loading

The Lead and its compounds have been widely used for many years in the electronics industry. However, the global demand to reduce the use of hazardous materials has compelled electronics manufacturers to consider lead-free materials in future products. The fast-growing application of lead-free materials in the electronics industry has brought new challenges with regards to the simulation of creep behavior.

This Whitepaper introduces some advanced features of SIMULIA  Abaqus that have made it a powerful design tool for the electronics industry in the lead-free era.

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