<?xml version="1.0" encoding="utf-8"?>
<rss version="2.0" xmlns:media="http://search.yahoo.com/mrss/" xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:dsy="http://www.3ds.com">
<channel>
	<title><![CDATA[Dassault Systemes events]]></title>
	<link><![CDATA[http://www.3ds.com/company/events/events-list/?override=0]]></link>
	<description><![CDATA[Latest Dassault Systemes events]]></description>
	<lastBuildDate>Mon, 20 May 2013 09:32:01 GMT</lastBuildDate>
	<copyright><![CDATA[2010 Dassault Systemes - All rights reserved]]></copyright>
	<image>
		<url>http://a1.media.3ds.com/fileadmin/LOGO/DASSAULT-SYSTEMES/logo_dassault_systemes.png</url>
		<title><![CDATA[Dassault Systemes events]]></title>
		<width>144</width>
		<height>45</height>
		<description><![CDATA[Latest Dassault Systemes events]]></description>
		<link><![CDATA[http://www.3ds.com/company/events/events-list/?override=0]]></link>
	</image>

	<item>
		<title><![CDATA[On demand Web seminar : "Design, source, produce and service fast anywhere"]]></title>
		<description><![CDATA[ On demand Web seminar :
Introducing "Single Source of SpeedSolution Experience" which enable company to achieve seamless, faster Product Development and Order Fulfillment processes to be conducted globally. ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From October 29, 2012 to June 30, 2013</strong><hr/><h5>Where</h5><strong>On demand Web seminar (Japan)</strong><hr/><h5>What</h5><p class="bodytext">Being an efficient industrial equipment company today in a very competitive market requires the ability to define and produce customized products that can be delivered to multiple geographic locations in record speed. Moreover, companies are required to provide services to installed equipment at any customer site around the world. </p>
<p class="bodytext">The Single Source&nbsp;for Speed solution from Dassault Systèmes allows companies to manage the entire product development process - from sourcing to design, production and services - across geographic locations. The solution leverages a single data model of the 3DEXPERIENCE platform which covers mechanical, piping and tubing, as well as electrical schematics processes. This enables all product development stakeholders to share and interact on a single source that is based on 3-dimensional (3D) models. </p>
<p class="bodytext">The lifelike experience of the virtual product enables all stakeholders to retrieve the right information in real time from anywhere, which improves communication and project monitoring. Industrial equipment companies can reduce costs and time to market while increasing product quality.<br /><br />In this web seminar, DS specialist will introduce how this experience will evolve your business.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/4482/?cHash=20864654aad43de17f4bacfe7621814d]]></link>
		<pubDate>Mon, 29 Oct 2012 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/Regional-Spotlights/Japan/images/events/webinar_JP_78-78.jpg" type="image/jpeg" length="3718"/>		
		<dsy:brand><![CDATA[3DSWYM,3DVIA,CATIA,DELMIA,ENOVIA,EXALEAD,GEOVIA,NETVIBES,SOLIDWORKS]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[ASEE 10th Annual K-12 Workshop on Engineering Education]]></title>
		<description><![CDATA[ "Tying STEM Together with Engineering". Join us for an energizing day of professional development and learn how to enhance STEM instruction through engineering education. ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From April 22, 2013 to June 22, 2013</strong><hr/><h5>Where</h5>Georgia World Congress Center
Atlanta, Georgia
USA <strong>Atlanta (United States)</strong><br/><a href="http://maps.google.com/maps?q=Georgia+World+Congress+Center%0D%0AAtlanta%2C+Georgia%0D%0AUSA+Atlanta" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="MsoNormal">&nbsp;</p>
<p class="MsoNormal">Dassault Systemes is the main sponsor of this event. To promote the DS Academia offer, DS will have three (3) 75 minute interactive workshop sessions, One (1) 30 minute speaking opportunity, a Table top display, a goodie in each attendee tote bags, one ad in the Conference program.</p>
<p class="MsoNormal">More info: <a href="http://www.asee.org/conferences-and-events/conferences/k-12-workshop/2013" target="_blank"  onclick="xt_med('C','59','events_list::www_asee_org_conferences_and_events_conferences_k_12_workshop_2013','S');">http://www.asee.org/conferences-and-events/conferences/k-12-workshop/2013</a></p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5054/?cHash=e2ac81f5b5913db77d1408d987323d75]]></link>
		<pubDate>Mon, 22 Apr 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/newsevents/Ewest_Event/Academia%20K12.png" type="" length=""/>		
		<dsy:brand><![CDATA[All]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[North America]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[Electronic Systems Technology and Conference 2013]]></title>
		<description><![CDATA[ The IPC ESTC program boasts a rich selection of presentations in each of the areas of specialized design, packaging, assembly or surface mount. ]]></description>
		<content:encoded><![CDATA[ 
		<img src="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/estc-icon-177x138.png" width="177" height="138" alt="#" /><h5>When</h5><strong>From May 20, 2013 to May 23, 2013</strong><hr/><h5>Where</h5>The New Tropicana <strong>Las Vegas, NV (United States)</strong><br/><a href="http://maps.google.com/maps?q=The+New+Tropicana+Las+Vegas%2C+NV" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">IPC ESTC is an exciting new event for the entire electronics industry, from foundry and components to board assemblies and complete systems. It’s an unprecedented opportunity to break new ground in the discussion of the technologies, products and services that will shape the future of the entire electronics industry.</p>
<p class="bodytext">The conference and exhibition are structured to provide the maximum benefit and convenience to attendees. Data-driven, high-quality papers will be presented by industry experts at the technical conference. &nbsp;New developments will be shared in half-day professional development courses. The exhibits, located in an adjoining hall, will showcase the latest products and services.</p>
<p class="bodytext">The most up-to-date information available will benefit people throughout the electronics industry, including:&nbsp;</p><ul><li>OEMs (Original Equipment Manufacturers)</li><li>IDMs (Integrated Device Manufacturers)</li><li>Fabless Semiconductor Companies</li><li>Semiconductor Foundries</li><li>Outsourced Semiconductor Assembly Test Services (OSATS)</li><li>Electronics Manufacturing Service (EMS) providers</li><li>Original Design Manufacturers (ODMs)</li><li>Printed Circuit Board (PCB) Manufacturers&nbsp;</li><li>Equipment, materials, and service providers</li><li>Academia and research centers</li></ul>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/4957/?cHash=ce004815eb502fed7a2b2eb4aa98d7b6]]></link>
		<pubDate>Mon, 20 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/estc-icon-78x78.png" type="image/png" length="14616"/>		
		<dsy:brand><![CDATA[SIMULIA]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[]]></dsy:industry>
		<dsy:region><![CDATA[]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[SAE 2013 Noise and Vibration Conference and Exhibition]]></title>
		<description><![CDATA[ The SAE Noise and Vibration Conference is the only dedicated mobility noise, vibration and harshness event in North America. Held biennially, this conference serves as a forum for leading automotive, commercial vehicle and aerospace professionals to share the latest technologies surrounding NVH and sound quality issues related to vehicle design, engineering and testing. ]]></description>
		<content:encoded><![CDATA[ 
		<img src="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/nvc2013-177x138.png" width="177" height="138" alt="#" /><h5>When</h5><strong>From May 20, 2013 to May 23, 2013</strong><hr/><h5>Where</h5>DeVos Place Convention Center <strong>Grand Rapids, MI (United States)</strong><br/><a href="http://maps.google.com/maps?q=DeVos+Place+Convention+Center+Grand+Rapids%2C+MI" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">The SAE Noise and Vibration Conference is the only dedicated mobility noise, vibration and harshness event in North America. Held biennially, this conference serves as a forum for leading automotive, commercial vehicle and aerospace professionals to share the latest technologies surrounding NVH and sound quality issues related to vehicle design, engineering and testing. </p>
<p class="bodytext">&nbsp;<img src="uploads/RTEmagicC_sae_noise_vibe2013.png.png" style="PADDING-BOTTOM: 12px; PADDING-RIGHT: 12px" height="86" width="348" alt=""><br />Topics include: </p><ul><li>Engine/Powertrain/Drivetrain </li><li>Heavy Vehicle and Vehicle Exterior </li><li>Numerical Methods </li><li>NVH Measurement </li><li>Passive and Active NVH Control </li><li>Standards, Process and Perspectives </li><li>Vehicle Subsystem NVH </li><li>Commercial and Specialty Vehicles </li></ul><p class="bodytext">Dassault Systemes SIMULIA will be exhibiting at the event, booth #234.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5198/?cHash=0394ce5cd788e6a571a7b87748f7d018]]></link>
		<pubDate>Mon, 20 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/nvc2013-78x78.png" type="image/png" length="9830"/>		
		<dsy:brand><![CDATA[SIMULIA]]></dsy:brand>
		<dsy:solution><![CDATA[BT]]></dsy:solution>
		<dsy:industry><![CDATA[]]></dsy:industry>
		<dsy:region><![CDATA[North America]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[2013 SIMULIA Community Conference]]></title>
		<description><![CDATA[ Vienna, Austria ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From May 21, 2013 to May 24, 2013</strong><hr/><h5>Where</h5><strong> (Austria)</strong>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/scc-2013/overview/]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/PRODUCTS/SIMULIA/IMG/events/scc-2013-banner-78x78.png" type="image/png" length="41783"/>		
		<dsy:brand><![CDATA[SIMULIA]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[Europe]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[SIMULIA Analysis Technology Seminar [Tokyo]]]></title>
		<description><![CDATA[ Dassault Systemes Realistic Simulation Brand, SIMULIA, is going to hold Analysis Technology Seminar. ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From May 21, 2013 to May 21, 2013</strong><hr/><h5>Where</h5>Bellesalle Yaesu in Tokyo <strong> (Japan)</strong><br/><a href="http://maps.google.com/maps?q=Bellesalle+Yaesu+in+Tokyo+" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">The Abaqus offers powerful and complete solutions for both routine and sphisticated engineering problems covering a vast spectrum of industrial applications. Every year, we add new capabilities and more than 100 enhancements to meet users' request and needs.</p>
<p class="bodytext">This seminar focuses topics such as analysis techiniques, modeling and approach to solve problem that we often receive questions from customers to our technical support. We are going to introduce Convergence, Fracture &amp; Failure and structure and fluid co-simulation by CEL.</p>
<p class="bodytext">It is going to be useful seminaro for both Abaqus users and non-Abaqus users. We are also going to introduce how Automation and Optimization software &quot;Isight&quot; can be integrate with Abaqus to maximize analysis simulations.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5006/?cHash=23fa89e98823a48673b2fe40325ee873]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/Regional-Spotlights/Japan/images/event/SIMULIA_Logo.png" type="image/png" length="66581"/>		
		<dsy:brand><![CDATA[All]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[SIMULIA Analysis Technology Seminar [Tokyo]]]></title>
		<description><![CDATA[ Dassault Systemes Realistic Simulation Brand, SIMULIA, is going to hold Analysis Technology Seminar. ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From May 21, 2013 to May 21, 2013</strong><hr/><h5>Where</h5>Bellesalle Yaesu in Tokyo <strong> (Japan)</strong><br/><a href="http://maps.google.com/maps?q=Bellesalle+Yaesu+in+Tokyo+" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">The Abaqus offers powerful and complete solutions for both routine and sphisticated engineering problems covering a vast spectrum of industrial applications. Every year, we add new capabilities and more than 100 enhancements to meet users' request and needs.</p>
<p class="bodytext">This seminar focuses topics such as analysis techiniques, modeling and approach to solve problem that we often receive questions from customers to our technical support. We are going to introduce Convergence, Fracture &amp; Failure and structure and fluid co-simulation by CEL.</p>
<p class="bodytext">It is going to be useful seminaro for both Abaqus users and non-Abaqus users. We are also going to introduce how Automation and Optimization software &quot;Isight&quot; can be integrate with Abaqus to maximize analysis simulations.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5010/?cHash=732878132b57e2704188483d51807031]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/Regional-Spotlights/Japan/images/event/3ds_seminars.jpg" type="image/jpeg" length="20949"/>		
		<dsy:brand><![CDATA[All]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[DELMIA 3D Experience Day 2013]]></title>
		<description><![CDATA[ We are glad to invite you to participate in Delmia 3D Experience Day 2013! ]]></description>
		<content:encoded><![CDATA[ 
		<h5>When</h5><strong>From May 21, 2013 to May 22, 2013</strong><hr/><h5>Where</h5>Renaissance Moscow Monarch Centre Hotel, 31A bld.1 Leningradsky prospect <strong>Moscow (Russia)</strong><br/><a href="http://maps.google.com/maps?q=Renaissance+Moscow+Monarch+Centre+Hotel%2C+31A+bld.1+Leningradsky+prospect+Moscow" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">&nbsp;Agenda</p>
<p class="bodytext">09:00 &nbsp;Welcome <br />09:30 &nbsp;Company Overview DS, Manufacturing Brand DELMIA, Digital Manufacturing <br />10:30 &nbsp;Coffee Break <br />11:00 &nbsp;Process Planning<br />11:30 &nbsp;Demo / Software presentation <br />12:00 &nbsp;Lunch <br />13:30 &nbsp;Assembly<br />14:15 &nbsp;Robotics <br />14:45 &nbsp;Coffee Break <br />15:15 &nbsp;Machining <br />15:45 &nbsp;Demo / Software presentation <br />16:15 &nbsp;Q&amp;A <br />16:45 &nbsp;Wrap Up <br />17:00 &nbsp;End </p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5130/?cHash=1f287d1664013cf7d03d0dffe260b8a4]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/PRODUCTS/DELMIA/IMG/home/Delmia%20User%20Day%202013%20bmp.bmp" type="" length=""/>		
		<dsy:brand><![CDATA[DELMIA]]></dsy:brand>
		<dsy:solution><![CDATA[All]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[All]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[V6R2013x]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[Insurance Day Summit - 21-22 May - London]]></title>
		<description><![CDATA[ Join us and listen to Kevin Pleiter, VP Industry Financial and Services, at the Insurance Day Summit in London on 21st-22nd May. ]]></description>
		<content:encoded><![CDATA[ 
		<img src="http://www.3ds.com/fileadmin/COMPANY/Regional-Spotlights/UKISA/UK-13-InsuranceDay-588x138.jpg" width="588" height="138" alt="#" /><h5>When</h5><strong>From May 21, 2013 to May 22, 2013</strong><hr/><h5>Where</h5>Dexter House Tower Hill <strong>London (United Kingdom)</strong><br/><a href="http://maps.google.com/maps?q=Dexter+House+Tower+Hill+London" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">Dassault Systemes will be sponsoring the Insurance Day Summit taking place in London on 21st-22nd May at the Dexter House Tower Hill.</p>
<p class="bodytext">The Summit brings together leaders from the London insurance market and around the globe to provoke clear thought on the future structure, direction and demands of the global risk industry and London’s role within it.<br /><br />The breadth of topics covered over two days, combined with expert opinion from a compelling mix of key industry stakeholders, regulators and political figures, means this is an event which should not be missed.<br /><br />More than 50 chief executives and senior management speakers will take to the Insurance Day stage to debate the most pressing economic, regulatory and business issues of the moment at the 2013 event, the theme of which is maximising profit and growth through economic challenges.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5136/?cHash=cafb020b51114928f140a36271211960]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/Regional-Spotlights/UKISA/UK-13-InsuranceDay-78x78.jpg" type="image/jpeg" length="21948"/>		
		<dsy:brand><![CDATA[All]]></dsy:brand>
		<dsy:solution><![CDATA[]]></dsy:solution>
		<dsy:industry><![CDATA[]]></dsy:industry>
		<dsy:region><![CDATA[Europe]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

	<item>
		<title><![CDATA[2013 Collaboration & Interoperability Congress]]></title>
		<description><![CDATA[ CIC is the only industry and CAD-neutral event in the world addressing collaboration and interoperability in product development, manufacturing and business communications. ]]></description>
		<content:encoded><![CDATA[ 
		<img src="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/cic2013-177x138.png" width="177" height="138" alt="#" /><h5>When</h5><strong>From May 21, 2013 to May 23, 2013</strong><hr/><h5>Where</h5>Cheyenne Mountain Conference Center
3225 Broadmoor Valley Rd, <strong>Colorado Springs, CO (United States)</strong><br/><a href="http://maps.google.com/maps?q=Cheyenne+Mountain+Conference+Center%0D%0A3225+Broadmoor+Valley+Rd%2C+Colorado+Springs%2C+CO" target="_blank">[+] Show on map</a><hr/><h5>What</h5><p class="bodytext">CIC has grown into a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions. The three-day international event is &quot;the place to go&quot; for executives, managers, senior engineers and IT professionals to network, learn and strategize with thought leaders from many sectors of discrete manufacturing, including automotive, aerospace, heavy equipment, and electronics industries, as well as with representatives from government and defense communities.</p>
<p class="bodytext">Dassault Systemes Americas is a proud sponsor of CIC 2013.&nbsp; Stop by our location, #15, in the Centennial Foyer, to discuss our 3DVIA Composer product.&nbsp; 3DVIA Composer allows you to repurpose existing 3D design data to more rapidly create and update high quality product deliverables including documentation, technical illustrations, animations, and interactive 3D experiences.</p>
		]]></content:encoded>
		<link><![CDATA[http://www.3ds.com/company/events/event-detail/events/single/5278/?cHash=658028ec53f595bbedfc4c3d222746ca]]></link>
		<pubDate>Tue, 21 May 2013 00:00:00 GMT</pubDate>
		<enclosure url="http://www.3ds.com/fileadmin/COMPANY/EVENTS/IMG/cic2013-78x78.png" type="image/png" length="11493"/>		
		<dsy:brand><![CDATA[3DVIA]]></dsy:brand>
		<dsy:solution><![CDATA[All]]></dsy:solution>
		<dsy:industry><![CDATA[All]]></dsy:industry>
		<dsy:region><![CDATA[North America]]></dsy:region>
		<dsy:country><![CDATA[]]></dsy:country>
		<dsy:release><![CDATA[]]></dsy:release>
		<category><![CDATA[]]></category>
	</item>

</channel>
</rss>
