Electronic Components and Technology Conference 2013

From May 28, 2013 to May 31, 2013
Cosmopolitan of Las Vegas Las Vegas, NV United States

The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information.

The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information.

As an integral part of Dassault Systèmes 3DEXPERIENCE platform SIMULIA applications for finite element analysis, multiphysics simulation, design optimization, and simulation lifecycle management accelerate the process of making mission-critical design and engineering decisions, before committing to costly and time-consuming physical prototypes.

Solutions: ExSight, Analysis for Experts Thermal Analysis, Fracture & Failure, Fatigue, Virtual Drop Test (Abaqus), Process Automation and Design Exploration (Isight)