Power of SIMULIA Portfolio 7: Designing and Calibrating Materials for Additive Manufacturing Processes


On Demand Webinar
English

This eSeminar from the Additive Manufacturing series will present how we integrate multi-scale material solutions. It is a must attend for engineers, research specialists, material scientists and manufacturing experts working across the Additive Manufacturing supply chain

This eSeminar is the third in the Additive Manufacturing series and we will present how we integrate multi-scale material solutions. Most materials have complex microstructures that determine their behavior at the continuum level. To effectively predict that behavior, we need to understand the effect of the microstructures at different length scales and follow the mechanics that it undergoes at different length scales. For both polymer and for metal AM processes, understanding of the material and its behavior at different length scales is critical in the prediction of residual stresses and part level distortions. For polymers, we will work through a multi-scale workflow starting with the construction and characterization of thermo-plastically cross-linked elastomeric co-polymers to using the material properties to predict their behavior at the part level. On the metal side, we will showcase how using accurate heat treatment based material models can be used to accurately predict the stress and distortions during the printing. Attendees will hear from both SIMULIA and BIOVIA experts on

  • Designing virtual materials for AM
  • Calibrating the properties of the materials to be used in continuum level simulations
  • Using the material to predict stress and distortion at part level
  • In-service performance of the printed parts using new materials

Engineers, research specialists, material scientists and manufacturing experts working across the Additive Manufacturing supply chain should attend this e-Seminar to learn more about how our simulation solutions can help design virtual material and learn how it will behave for AM applications