Opening Up New Horizons with 3DEXPERIENCE

Integrated Circuits (IC) are essential components in products across nearly every industry ranging from consumer electronic to automotive and medical device. Since its conception, semiconductor continue to advance to the point where whole systems with billions of parts live on a device that can fit within the palm of a hand. These systems require complex design, done in collaboration by experts in various functional areas, and equally complex manufacturing processes. Semiconductor companies rely on 3DS' Product Life Cycle Management (PLM) solution to bring this complex product to market and gain a competitive advantage in the rapidly changing market.

We provide scalable solutions across the multiple domains within the semiconductor product lifecycle. Dozens of industry-leading companies are using our products in production today to help drive their success, including over three-quarters of the world's top 20 semiconductor companies and many smaller, emerging companies seeking to increase their competitive advantage. Here are the benefits of 3DS PLM solutions:

Improve Visibility and Control of Design Efforts

Semiconductor organizations have evolved to address the new normal: team has been reduced and is distributed across multiple sites. Managers need to determine the optimal way to support project portfolios while getting a handle on the strength and availability of resources. Projects have increased reuse and hierarchical project planning is a necessity. And the need to tighten the link between project plans and design deliverables can make the difference between high-quality, on-time releases or costly delays. 3DS PLM ties together all of the product portfolio management data from the multiple separate sources so managers can meet their objectives. 

Deploy a Collaborative Design Management Environment

With multi-discipline design teams stationed around the globe, complex IC design has new challenges above and beyond technology. Managing the design efforts, developing large amounts of data in the form of design libraries, creating reusable IP blocks and creating a communication flow that can drive the handoff, issue and action flows are prerequisite for design methodologists. The complexity of the design information makes this collaborative design environment a must-have technology. Today’s complex IC products require a mix of skills from analog, digital, embedded software, packaging and verification to drive success. 3DS PLM Solution enables semiconductor companies to align all of their design resources in a single environment in order to optimize efficiency and meet product quality goals. This helps improve top-line revenue while reducing bottom-line fabrication costs.

Reducing the Cost of Change

As one of the largest manufacturing industries, a widely recognized concern within semiconductor is the high cost of change. Design tools and methodologies are constantly enhanced to target first-pass success and reduce the high NRE (Non-Recurring Engineering) costs associated with mask spins. Many of the costly changes to the IC designs are a result of communication gaps: between customers and engineers, between design and manufacturing organizations and betwee design teams. 3DS PLM solution aligns requirements to product configurations to bills of materials (BOMs) to ensure that there are no issues resulting in misalignment between intent, design and reality.

Virtual Product Validation

With IC designs exceeding 2 billion transistors and products being applied to multiple industries, simulation is essential to maintaining product quality and sustainability. IC design includes logical, behavioral and physical simulations at both chip and system level. 3DS PLM creates an environment that can align the results from multiple simulations in an automated process control flow to allow engineers to maximize verification cycles and identify issues before producing prototypes or physical products. As semiconductor products have a variety of applications, the need to simulate for thermal, moisture, radiation, drops and other conditions is essential. To learn more, click here